Polymers and Packaging

We are working on the development of polymer ceramic composites to overcome the low dielectric constant (er~2.2-2.8) of pure polymers and to further allow for dielectric constant throughout the polymer composite volume. In collaboration with Prof. Derek Hansford, Nanotech West Laboratory of The Ohio State University, our goal is to develop fabrication techniques and substrate designs that combine/mix layers of high contrast ceramic (LTCC and HTCC) powders at appropriate locations within the substrate to reduce antenna, feedline and phase shifter size and concurrently increase functionality. Due to their rigidity, LTCC materials alone do not allow for conformality and ease of integration with other circuits and feed networks. However, we are working on providing design rules and technological foundations that would lead to new low-cost, low-volume, light-weight, conformal RF modules that can find many applications including:

• System-on-Package integration,
• military wireless sensing and communications,
• remote vehicle control,
• disposable wireless tags, and
• in automobile RF component design (antennas, wireless sensors).

Conductive printing on the composites is also under investigation. The examined technique is based on microtransfer molding (µTM) and lift-off for pattern formation.  A key feature is the usage of microtextured PDMS and PDMS-ceramic composites before any copper film deposition.